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Interfaces

3DV-EdgeAI-32 interfaces​

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Interface layout on the front panel (left to right):​

  • LTE AUX: SMA connector for connecting the auxiliary antenna of the 3G/LTE/4G module. Used for connecting an external antenna if the device is equipped with the optional 3G/LTE/4G module (M.2 key B connector).

  • LTE MAIN: SMA connector for connecting the main antenna of the 3G/LTE/4G module. Used for connecting an external antenna if the device is equipped with the optional 3G/LTE/4G module (M.2 key B connector).

  • WIFI AUX: SMA connector for connecting the auxiliary antenna of the WiFi-Bluetooth module. Used for connecting an external antenna if the device is equipped with the optional module (M.2 key A+E).

  • WIFI MAIN: SMA connector for connecting the main antenna of the WiFi-Bluetooth module. Used for connecting an external antenna if the device is equipped with the optional module (M.2 key A+E).

  • GNSS: SMA connector for connecting an external GNSS/GPS antenna (included with the device). The device supports active GNSS antennas.

  • USB: 1 USB 3.0 port for connecting external devices.

  • ETH: 1 Ethernet port supporting data transfer speed up to 1000 Mbps.

  • SERIAL: RG-45 connector for connecting RS-232, RS-485, and CAN interfaces. The pinout for these interfaces is shown below:

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  • PWR: Power connector for connecting external power in the range of 9 to 36 Volts DC. Power consumption at 12V is up to 4A. A connector (included in the package, red wire +, black -) is required to connect external power.

  • Bi-color Indicator: Located to the right of the connector, the bi-color indicator (red/green) displays the operational modes of the device.

  • ON/OFF: Power button.

Installing additional devices​

Removing the top panel: To access the motherboard and computing module, unscrew the four screws securing the top cover. Gently pry the cover up from one side. The cover is attached to the processor on the computing module via a layer of thermal paste and will require some effort to detach.

Module layout on the motherboard:

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  1. MicroSIM Slot
  2. M.2 NVME
  3. Connector for 3G/LTE/4G Module
  4. Connector for WiFi-Bluetooth Module
  5. MicroSD Slot

Installing the top panel: Before reassembling, ensure that an adequate amount of thermal paste is applied to the processor to facilitate heat transfer with the casing. Note that the processor on the computing module is not protected by an external heatsink and may be easily damaged due to uneven pressure or rough handling.

Reassembly steps:

  1. Align the tab on the cover with the groove on the casing.
  2. Insert the four screws into their respective holes on the cover.
  3. Tighten the screws until they make contact with the cover, ensuring that the gap between the cover and casing is approximately the same on all four sides.
  4. Tighten the screws in a cross pattern, in several passes, to prevent tilting of the cover. The cover sits directly against the processor, and tilting could cause damage.